Njalo ngonyaka, kuvela izinto ezintsha zokwakha emashalofini ezitolo zokwakha, ezingenazo izici ezithuthuke kakhulu kunangaphambili, kodwa futhi kulula ukuzifaka. Enye yalezi zinto zokwakha i-cence-chipboard, enesilinganiso esibanzi sohlelo lokusebenza.
Kepha ngaphambi kokubheka izici zomsebenzi wokufaka, zizophendula umbuzo wokuthi yiphi i-CSP, eyenziwe kuyo, nokuthi yini ezuzwayo.
Khiqiza
Ngokwenziwa kwesimende-chipboard, ama-chip wokhuni, ukwakheka kwesimende, amanzi, usawoti we-aluminium, kusetshenziswa amakhemikhali. Uma sibheka iphesenti lezakhi eziyingxenye yezinto ezibonakalayo, isisekelo sezinto ezibonakalayo ukwakheka kwesimende (65%).
Ama-Wood chips asebenzisa izingxenyana ezihlukile, futhi kungu-25% walesi sifundo sokwakha. Izithasiselo zamanzi namakhemikhali zifakiwe ezintweni eziyi-8,5 no-2,5%, ngokulandelana.
Ama-chip wokhuni anamaminerali ezingubeni ezikhethekile. Ngemuva kwalokho, kufakwa ukwakheka kwamanzi nosimende. Lesi sisindo sithululelwa esitsheni. Kulokhu, isakhiwo se-multilayer sesivele sakhiwa. Ngaphakathi kwepuleti kungama-chips wokhuni anengxenye enkulu.
Ngaphandle kwaleli chip chorips awlow Force. Ukuthola i-monolithic slab, okuqukethwe kuthunyelwe ngaphansi kwabezindaba. Ukuphuma kungumkhiqizo we-monolithic, ukulungele ukusetshenziswa. Izinto ezitholakala ngaleyo ndlela azidingi ukuvumelananisa, okukuvumela ukuthi uzisebenzise lapho uhlela i-screed eyomile.
Ngaphezu kokuhlelwa phansi phansi, i-cent-chipboard ingasetshenziswa ukuqeda ama-facades nokwakhiwa kokuhlukaniswa ngaphakathi kwesakhiwo, ngesikhathi sokuhlobisa ingaphakathi, ukubuyiselwa kwale ndawo.
Isithunzi
Okokuqala, kufanele kuphawulwe iqiniso lokuthi i-CSP ayesabi umswakama. Emini, izinto ezibonakalayo zithola kungabi ngaphezu kwe-16% yamanzi akhiwe esitofini. Ekuhlolweni kwamanzi, i-CSP ngosuku yandisa ngaphezu kwama-5%. Ngakho-ke, lokho okuqukethwe kutholile ukusetshenziswa kwayo ekuhlelweni kwezindawo ezinomswakama ophezulu. Ukumelana nomswakama kukuvumela ukuthi usebenzise lokhu okuqukethwe lapho ufaka uhlelo lobunjiniyela bamanzi "uPaul Omfudumele".
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Ngaphezu kokumelana nomswakama, kuyadingeka ukuqaphela ukumelana nokungafani okubukhali kwemodi yokushisa. Kwabathengi abaningi namuhla, ubungane bezemvelo bokuqukethwe kubalulekile. Uma ubheka ukuthi isisekelo se-CSP siyisimende, isihlabathi, amanzi nezinkuni, singaphethwa ngobungane bezemvelo balokho okuqukethwe.
Ngaphezu kwalezi zinzuzo, kufanele kuphawulwe ukumelana nomlilo. Ipuleti le-CSP liyakwazi ukubekezelela umlilo imizuzu engama-50.
Ezinye izici ezimbili ezibalulekile ezakhiweni zokuhlala: Ukuvuselelwa okuphansi okushisayo (0.26 W) kanye nokufakwa okunengqondo okuphezulu. Phansi, ngokuhlelwa kwe-CSPs yepuleti.
Futhi-ke, kufanelekile ukuba uqonde amandla aphezulu ezinto ezibonakalayo. Ingafakwa, zombili endaweni ebheke phezulu neqondile.
Ukuhleleka kwephansi nge-CSP
Ngaphezu kwesimende-chipboard uqobo, kuyadingeka ukulungiselela kuqala ithuluzi lokwakha. Okungukuthi:
- Ithuluzi lamapuleti okusika (ungasebenzisa i-hacksaw ejwayelekile);
- Izikulufo zokuzishaya;
- i-roller e-rambling (uma umsebenzi wenziwa endlini yangasese);
- ummese we-putty;
- Ukukhetha i-blade (uma kufika esisekelweni sokhuni).
Kuyinto efiselekayo ne-arm screwdriver, isicelo sakhe sizokwenza lula kakhulu ukubhala umsebenzi.
I-Chip-Chip, i-Mastic, i-Primer ne-Crusched Stone izodingeka ezintweni zokwakha.
Imisebenzi iqala ukuhlela ukuhlelwa phansi phansi kusuka ekuhlelweni kwesisekelo. Uma sikhuluma ngendlu yamathambo, inhlabathi itholakala ngaphansi kwayo, kuyodingeka ukuthi uqale ngokuhlelwa komcamelo ngaphansi kwe-CSP. Umcamelo onjalo wenziwe ngemfucumfucu.
I-SECTELVE blade kufanele isuswe ungqimba lwenhlabathi olungaphezulu futhi lwakha umgodi ongajulile ngaphansi komcamelo wamatshe amatshe. Kuyadingeka ukuze kushise phansi phansi endlini futhi kuvikele kusuka kumswakama. Ungqimba lwemfucumfucu lubekwe emgodini olungiselelwe. Kudinga ukuba muhle, usebenzisa i-roller eqashisayo.
Uma isisekelo esimnyama sikhonkolo, khona-ke i-DSP ibekwe kwi-substrate ekhethekile noma eLags. Uma sikhuluma ngohlelo lwezakhiwo ezingezona ezenzelwe ukuhlala, akunangqondo ukusebenzisa imali nesikhathi ekufakweni kwe-lag. Uma umsebenzi wenziwa egumbini lokuhlala, kungcono ukubeka usimende-chipboard emasimini.
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Lapho ubeka amatshe kasimende-chipstones, udinga ukuqiniseka ukuthi bakubeka ngokuqinile komunye nomunye. Sula futhi izikhala akufanele zenziwe. Kungcono ukumisa ukukhetha kwakho kokuqukethwe, ubukhulu bawo obudlula ama-4 cm. Ubukhulu obuncane be-slab, i-yehlisa izakhiwo zayo ezifaka amandla.
Uma ama-slabs angena ema-lags, khona-ke ukungabi nalutho phakathi kwama-lags kungagcwaliswa ngezinto zokufaka ezifakayo. Kungcono ukumisa ukukhetha kwakho ekufakweni kwe-Bulk Thermal. Izinto ezigoqiwe kuzofanele zisikwe. Ngasikhathi sinye, ukuwabeka ngendlela yokuthi ungayeki ukungabi nalutho, kuzoba nzima impela.
Njenge-resort yokugcina, ungahlanganisa izinto zokufaka okushisayo nezibunzi. Kuyafaneleka ukusebenzisa ukufakwa okushisayo, okumelana nomswakama. Ngaphandle kwalokho, kuzofanela ukuba bahlanganyele ekuvinjelweni okungavunyelwe, okuzoholela ekukhuphukeni kwezindleko zomsebenzi womhlangano.
Uma kukhiqizwa isitayela engxenyeni engezansi, impahla yokufakelwa okushisayo ingatholwa ngaphezulu kwesimende-chipboard. Kungcono ukusebenzisa izinto ezigoqiwe okokuqala kudingeka unqume amabhendi obude obufunayo. Amalunga wale michilo ahlelwe ngetheyipu enamathela. Lokhu kwenziwa ukuze ku-oda lokufakwa okwengeziwe, ukufakwa okushisayo akukuguquki futhi kungawonakali.
Ngemuva kokubeka usimende-chipboard, ungaya endaweni yokuhlobisa. Uma uhlela ukwengeza phansi kokhuni, kuzofanele ufake ama-lags futhi ngaphezulu kwe-CSP. Lapho ufaka ama-lags, udinga ukusebenzisa izinga lokwakha.
Ngaphandle kwalokho, isisekelo ngeke singalingani. Okwe-lags, uma kunesidingo, ungabeka ukunqunywa kwamabhodi ezinkuni, ama-wedges akhethekile, izingcezu ze-drywall noma i-cement-chipboard ngokwazo, njll.
Uma kukhona amabhodi amakhulu lapho ufaka phansi kokhuni, khona-ke udinga ukumisa ukukhetha kwakho ku-Cecy-Chipbhodile, ezomelana nemithwalo ephezulu. Uma i-ceramic tile isetshenziswa njengesembozo esiphansi, kwanele ukusebenzisa i-centment-chipboard, ukushuba kwalokho okungu-1.6 cm. Kepha ngaphambi kokuqhubeka nokubeka i-ceramic tile, ingaphezulu lezitovo zomasimende kufanele ziphathwe nge-primer.
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Ukwandisa ukunamathela ungangeza oxhumana nokhonkolo ku-primer. Futhi ungafaka ungqimba wokuxhumana ngokhonkolo ngokwahlukana ngaphezulu kwenhlabathi. Imisebenzi elandelayo ingafakwa kuphela ngemuva kokomisa inhlabathi. Ochwepheshe banconywa ngaphambi kokufaka isicelo sokwakheka kwama-tile ukufaka ama-grid aqinisiwe phansi. Kuyinto elula ukukwenza nge-stapler yokwakha. Kepha ukusetshenziswa kokunamathela kokunamathela kulokhu kuzokhulisa kakhulu, okuzoholela ekukhuphukeni kwezindleko zomsebenzi womhlangano.
Ngokuqondene nebhodi elihlanjululwe, i-linoleum, ukhaphethi noma i-parquet, ochwepheshe bancoma ukusebenzisa amapuleti ubukhulu bawo abangu-2 cm. Ungaba yi-Chip-Chipboard ukuze uzuze kungqimba ezi-2. Kulokhu, kungakuhle ukuthi usebenzise impahla eyi-1.6 cm.
Ukusetshenziswa kwamapuleti kasimende-pall kukhalisa kakhulu umsebenzi womhlangano. Ngaphezu kwalokho, okuqukethwe kubonakaliswa ngamandla aphezulu kanye nokumelana nomonakalo wezinhlobo ezahlukene. Kwenze kwaba nokwenzeka ukusetshenziswa kwayo emakamelweni anomswakama ophezulu. I-Cecture-Chipboard ingasetshenziselwa umsebenzi wangaphakathi nangaphandle. Zibalulekile lapho zihlela i-screeph eyomile noma ophahleni lwendlu.
Imakethe ikhombisa okubonakalayo kobukhulu obuhlukile. Amapuleti amakhulu alungele izindawo ezindlini zangasese, futhi amashidi amancanyana angasetshenziswa ukuhlela phansi phansi amafulethi.